Once the product is designed & ready for manufacturing production, ISE Europe guides customers through the engineering/production phases, covering most of the available products in the market, such as:
- Flip Chip
- SIP Module
There are many things that we need to keep in mind from a manufacturing prospective. Engineering resource, BOM, logistics, IT system, forecast and capacity allocation are only a few examples, and any mistake here might cause unpleasant production issues.
To avoid this, ISE Europe will work closely with customers to ensure a smooth production flow.
ISE Europe provides all kind of test solutions for both wafer test and final test covering all different market applications: Digital, Mixed Signal and RF devices. The test engineering team provide full support during the development of customer's solutions following all test requirements. Test solutions include:
- High-Speed and Temperature Wafer testing
- Temperature Control Probing and Cold Probing
- From 6'' to 12''
- Wafer Mapping and Inking
- Multiple Sites testing
- Handlers: Seiko/Epson, Delta Flex, Synax, etc.